Industry News

AWA IMLCON™ IMDCON™ IMECON™ 2019: Leading event for in-mold technologies set for Sept. 5-6 in Chicago

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Embracing in-mold labeling, in-mold product decoration, and in-mold electronics, AWA Conferences & Events’ dedicated annual conference on in-mold technologies and markets — IMLCON™ IMDCON™ IMECON™ — takes place this year Sept. 5-6 in Chicago, IL. The 2019 theme is “Collaboration, sustainability and new technologies.”

For all involved, or interested in any aspect of in-mold activity, the three concurrent tracks dedicated to IML, IMD and IME will enable delegates to explore the related technologies, markets, and applications in depth. The event will feature a comprehensive program of presentations by leading industry experts. Topics will include the latest technologies, discussions on today’s industry issues, innovations, and up-to-date market intelligence.

The ever-broader content of what was originally the IMLCON™ conference, which first took place 23 years ago, is a reflection of the lively, changing,  and growing market for in-mold technologies. Alternating annually between Europe and North America, IMLCON IMDCON IMECON 2019 is taking place at the Hyatt Rosemont Hotel in Chicago. In addition to the formal agenda, it features a tabletop exhibition and extensive opportunities for networking. 

Registration is now open — early registration is advisable for such a well-attended industry event — and may be booked online via the AWA website, www.awa-bv.com, where program details are also available.



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